WIRE BONDING

• Gold Wire: 25μm (0.001 inch) diameter

BONDING

• Thermo compression, ultrasonic ball bonding

• Required stage temperature: 150˚C to 200˚C

• Required wedge or capillary weight: 0.2N to 0.5N

• Bond the capacitor and base substrate or other devices with gold wire

FEATURES

• Designed specifically for wire bonding and application of gold-tin (AuSN) solder*

• Ideal for mounting in packages, such as optical communication related devices, IC, etc.

• Contributes to miniaturization of the set