Wire Bonding Recommendations and Guidelines


• Gold Wire: 25μm (0.001 inch) diameter


• Thermo compression, ultrasonic ball bonding

• Required stage temperature: 150˚C to 200˚C

• Required wedge or capillary weight: 0.2N to 0.5N

• Bond the capacitor and base substrate or other devices with gold wire


• Designed specifically for wire bonding and application of gold-tin (AuSN) solder*

• Ideal for mounting in packages, such as optical communication related devices, IC, etc.

• Contributes to miniaturization of the set

Wire Bonding Recommendations and Guidelines (PDF)
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