Passive Component Soldering Profiles
VENKEL'S RECOMMENDED SOLDERING PROFILES
Soldering conditions are affected by mounting and PCB parameters. Please take these factors into account when using these solder profiles. These are recommendations only and no guarantees are implied by them.
COMPONENT TESTING AFTER REFLOW/REWORK FOR MLCC'S:
All component testing after reflow/rework should be performed after ≥ 24hrs to ensure accurate capacitance value measurements. Capacitors should be cooled at room temperature for a minimum of 24 hours to allow the ceramic material to reset (age).
MSL (Moisture Sensitivity Level) is 1
MAXIMUM NUMBER OF REFLOW CYCLES
Maximum Number of Reflow Cycles is 2
RECOMMENDED SOLDERING CONDITION (REFERENCE)
Recommended condition of Tin(Sn) solder
FLOW OR WAVE SOLDERNG
Recommended condition of Tin(Sn) and Tin-Lead (Sn-Pb) solder